The 100 G solution by 4 x 25 G requires direct modulated uncooled DFB/DBR in the 1310 nm range CWDM or ITU-T grid spaced. Fig. 3 shows a block diagram for such an optical module. The new performed lasers are in the 4 x 25 G WDM TOSA. The form factor for the module could be the XENPAK. To develop the laser for this application is the challenge for the institutes in this project.
Today no commercial uncooled 25 G DFBs/DBRs exist. To fit in the LX4 technology a new packaging technology based on OptoPack has to be developed under yield data to support standards development, to accurately predict performance and cost. The standardisation in the HSSG is scheduled in Fig. 5. Now it is very important to synchronise the project to this schedule. On one hand the standard can be supported and on the other hand the European research institutes can be in front and get the leadership in development cost reduced laser diodes. For the European module suppliers is the advanced know how from the European institutes also challenge to go in front of the module development. The strategy is to realise the prototypes in the academic / research institutes and then transfer production to the SME partners. Modulight will perform manufacturability tests and will adjust the device fabrication for an industrial environment. With its current capacity Modulight is able to provide MergeOptics with device volumes from pilot production to medium quantities. In the longer run, if the demand for these devices increases significantly, Modulight is capable and willing to expand in order to meet the market needs.